Dissolving copper plating device
Semi-additive pattern plating is also possible! We would like to introduce our molten copper plating equipment.
The device can perform electrolytic copper plating on blind vias and through holes. Material thickness ranges from PI 25μm, and material width is up to 540mm. Semi-additive pattern plating is also possible. Additionally, plating for CCL materials is available. Please feel free to consult us. 【Specifications】 ■ Lane configuration: 1 Lane ■ Transport speed: 0.5m to 1.5m/min (depending on specifications) ■ Material width: 540mm ■ Material thickness: PI 25μm and above ■ Processing surface: Both sides (one side or both sides) *For more details, please refer to the PDF document or feel free to contact us.
- Company：SETO ENGINEERING 守谷事業所
- Price：Other
